Plasma processing: Difference between revisions

Revision as of 08:13, 25 February 2004

Latest revision as of 11:56, 30 December 2023

(36 intermediate revisions by 26 users not shown)

Line 1:

{{Refimprove|date=September 2022}}

'''Plasma pocessing''' is a [[plasma]]-based material processing technology that aims at modifying the chemical and physical properties of a surface.

'''Plasma processing''' is a [[Plasma (physics)|plasma]]-based material processing technology that aims at modifying the chemical and physical properties of a surface.<ref>{{cite book |last1=National Research Council |title=Plasma Processing of Materials: Scientific Opportunities and Technological Challenges |date=1991 |publisher=National Academies Press |___location=Washington, DC |doi=10.17226/1875 |isbn=978-0-309-04597-1 |url=https://doi.org/10.17226/1875}}</ref>

Plasma processing techniques include:

*[[Plasma activation]]

*[[Plasma modificationashing]]

*[[Plasma cleaning]]

*[[Plasma electrolytic oxidation]]

*[[Plasma etching]]

*[[Plasma functionalization]]

*[[Plasma polymerization]]

*[[Corona treatment]]

*Plasma modification

Related topics are [[plasma chemistry]], [[chemical vapor deposition]], and [[physical vapor deposition]] processes like [[sputteringsputter deposition]], [[plasma ioniondoping, [[vacuum dopingplasmaspraying]], and [[reactive ion etching]].

==References==

Related topics are [[plasma chemistry]], [[chemical vapor deposition]], and [[physical vapor deposition]] processes like [[sputtering]], [[plasma ion doping]], and [[reactive ion etching]].

{{reflist}}

{{DEFAULTSORT:Plasma Processing}}

[[Category:Plasma processing| ]]