Plasma processing: Difference between revisions

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'''Plasma processing''' is a [[Plasma (physics)|plasma]]-based material processing technology that aims at modifying the chemical and physical properties of a surface.

'''Plasma processing''' is a [[Plasma (physics)|plasma]]-based material processing technology that aims at modifying the chemical and physical properties of a surface.<ref>{{cite book |last1=National Research Council |title=Plasma Processing of Materials: Scientific Opportunities and Technological Challenges |date=1991 |publisher=National Academies Press |___location=Washington, DC |doi=10.17226/1875 |isbn=978-0-309-04597-1 |url=https://doi.org/10.17226/1875}}</ref>

Plasma processing techniques include:

*[[Plasma activation]]

*[[Plasma ashing]]

*[[Plasma cleaning]]

*[[Plasma electrolytic oxidation]]

*[[Plasma etching]]

*Plasma modification

*[[Plasma functionalization]]

*[[Plasma polymerization]]

*[[PlasmaCorona cleaningtreatment]]

*[[Plasma electrolytic oxidation]]modification

Related topics are [[plasma chemistry]], [[chemical vapor deposition]], and [[physical vapor deposition]] processes like [[sputter deposition]], plasma iondoping, [[vacuum plasmaspraying]], and [[reactive ion etching]].

==See also==

*[[List of plasma (physics) applications articles]]

==References==

{{reflist}}

{{DEFAULTSORT:Plasma Processing}}

[[Category:Plasma processing| ]]