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The '''Open NAND Flash Interface Working Group''' ('''ONFI''' or '''ONFi'''<ref>{{cite web |url=http://onfi.org/presentations/ |title=ONFI web site presentation page |publisher=[[ONFI]].org |access-date=2010-07-31 |archive-date=2010-08-02 |archive-url=https://web.archive.org/web/20100802165609/http://onfi.org/presentations/ |url-status=dead }}</ref> with a lower case "i") is a [[consortium]] of technology companies working to develop [[open standards]] for [[NAND flash|NAND]] [[flash memory]] and devices that communicate with them. The formation of ONFI was announced at the [[Intel Developer Forum]] in March 2006.<ref name="start">{{Cite news |url= http://onfi.org/news-events/new-group-simplifies-nand-flash-integration/ |title= New Group Simplifies NAND Flash Integration |work= Press release |publisher= ONFI |date= May 9, 2006
== History==
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Thus, one of the main motivations for standardization of NAND flash was to make it easier to switch between NAND chips from different producers, thereby permitting faster development of NAND-based products and lower prices via increased [[competition (economics)|competition]] among manufacturers.
By 2006, NAND flash became increasingly a [[commodity]] product,<ref name="huffman-abraham">See this [http://www.onfi.org/presentations/IDF_S06_MEMS005_rev_H_USA.ppt presentation] {{Webarchive|url=https://web.archive.org/web/20070712092718/http://www.onfi.org/presentations/IDF_S06_MEMS005_rev_H_USA.ppt |date=2007-07-12 }} by Amber Huffman and Michael Abraham of [[Micron Technology|Micron]].</ref> like [[SDRAM]] or [[hard disk]] drives. It is incorporated into many [[personal computer]] and consumer electronics products such as [[USB flash drive]]s, [[MP3 player]]s, and [[solid-state drive]]s. Product designers wanted newer NAND flash chips, for example, to be as easily interchangeable as hard disks from different manufacturers.<ref name="huffman-abraham"/><ref>{{Cite news |title= Simplify Your Flash-Memory Interface |author= Jim Cooke |work= [[Dr. Dobb's Journal]] |date= September 25, 2006 |url= http://www.ddj.com/dept/embedded/193005155 |access-date= September 13, 2013 }}</ref>
=== Historical similarities ===
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=== Members ===
The ONFI consortium included manufacturers of NAND flash memory such as [[Hynix]], [[Intel]], [[Micron Technology]], [[Phison]], [[Western Digital]], [[Sony]] and [[Spansion]].<ref name="start" /> [[Samsung]], the world's largest manufacturer of NAND flash, was absent in 2006.<ref>{{Cite news |work= [[The Register]] |title= Intel primes Flash standardisation push: Industry body formed to define common interface |author= Tony Smith |date= May 11, 2006 |url= http://www.reghardware.co.uk/2006/05/11/intel_onfi_working_group_formed/ |access-date= September 13, 2013 |archive-date= February 6, 2010 |archive-url= https://web.archive.org/web/20100206005505/http://www.reghardware.co.uk/2006/05/11/intel_onfi_working_group_formed/ |url-status= dead }}</ref>
Vendors of NAND flash-based consumer electronics and computing products are also members.
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Version 1.0 of this specification was released on December 28, 2006, and made available at no cost from the ONFI web site.
Samsung was still not a participant.<ref>{{Cite news |work= The Register |title= Vendors pledge to make Flash as easy to upgrade as RAM: Open Flash spec published |author= Tony Smith |date= January 22, 2007 |url= http://www.reghardware.co.uk/2006/05/11/intel_onfi_working_group_formed/ |access-date= September 13, 2013 |archive-date= February 6, 2010 |archive-url= https://web.archive.org/web/20100206005505/http://www.reghardware.co.uk/2006/05/11/intel_onfi_working_group_formed/ |url-status= dead }}</ref>
It specified:
* a standard physical interface ([[pinout]]) for NAND flash in [[Thin small-outline package|TSOP]]-48, WSOP-48, [[Land grid array|LGA]]-52, and [[Ball grid array|BGA]]-63 [[IC package|package]]s
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'''Version 2.3''' was published in August 2010. It included a protocol called EZ-NAND that hid ECC details.<ref>{{Cite news|url=http://www.eetimes.com/document.asp?doc_id=1257130|title=NAND specification adds error correction|author=Mark LaPedus|date=August 16, 2010|work=EE Times|access-date=September 13, 2013}}</ref>
'''Version 3.0''' was published in March 2011. It required fewer chip-enable pins enabling more efficient [[printed circuit board]] routing.<ref>{{Cite web|url=http://www.onfi.org/~/media/ONFI/specs/ONFI_3_0_Gold.pdf|title=ONFI specification version 3.0|date=March 15, 2011|access-date=September 13, 2013|archive-date=February 2, 2013|archive-url=https://web.archive.org/web/20130202205038/http://www.onfi.org/~/media/ONFI/specs/ONFI_3_0_Gold.pdf|url-status=dead}}</ref>
A standard developed jointly with the [[JEDEC]] was published in October 2012.<ref>{{Cite news|url=http://www.jedec.org/news/pressreleases/jedec-and-open-nand-flash-interface-workgroup-publish-nand-flash-interface-intero|title=JEDEC and the Open NAND Flash Interface Workgroup Publish NAND Flash Interface Interoperability Standard|date=November 6, 2012|work=Press release|access-date=September 13, 2013|publisher=JEDEC}}</ref><ref>{{Cite web|url=http://www.onfi.org/~/media/ONFI/specs/JESD230.pdf|title=NAND Flash Interface Interoperability: JEDSD230|date=October 30, 2012|access-date=September 13, 2013|archive-date=July 21, 2013|archive-url=https://web.archive.org/web/20130721195023/http://www.onfi.org/~/media/ONFI/specs/JESD230.pdf|url-status=dead}}</ref>
'''Version 3.1''', published in october of 2012, includes errata to the original ONFI 3.0 specification, adds LUN SET/GET Features commands, and implements additional data setup and hold values for NV-DDR2 interface.
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'''Version 4.2''', published on February 12, 2020, extends NV-DDR3 I/O speeds to 1333MT/s, 1466MT/s and 1600MT/s. The BGA-252b four channel package is introduced which has a smaller footprint than the existing BGA-272b four channel package. To enable higher IOPS multi-plane operations, addressing restrictions related to multi-plane operations are relaxed.<ref>{{Cite web|date=2020-02-12|title=Open NAND Flash Interface Specification Revision 4.2|url=https://media-www.micron.com/-/media/client/onfi/specs/onfi_4_2-gold.pdf}}</ref>
'''Version 5.0''', Published in May
===Block Abstracted NAND===
ONFI created the Block Abstracted NAND addendum specification to simplify host controller design by relieving the host of the complexities of ECC, bad block management, and other low-level NAND management tasks. The ONFI Block Abstracted NAND revision 1.1 specification adds the high speed source synchronous interface, which provides up to a 5X improvement in bandwidth compared with the traditional asynchronous NAND interface.<ref>{{Cite web |title= Block Abstracted NAND specification version 1.1 |date= July 8, 2009 |url= http://www.onfi.org/~/media/ONFI/specs/BA_NAND_rev_1_1_Gold.pdf |access-date= September 13, 2013 |archive-date= December 30, 2013 |archive-url= https://web.archive.org/web/20131230051420/http://www.onfi.org/~/media/ONFI/specs/BA_NAND_rev_1_1_Gold.pdf |url-status= dead }}</ref>
===NAND Connector===
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