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{{short description|Form of digital logic family in integrated circuits}}
[[File:Nmos depletion and.svg|right|thumb|A depletion-load and two enhancement-mode NMOS transistor making up [[NAND gate]].]]
In [[integrated circuit]]s, '''depletion-load NMOS''' is a form of digital [[logic family]] that uses only a single power supply voltage, unlike earlier [[NMOS logic|NMOS]] (n-type [[metal-oxide semiconductor]]) logic families that needed
[[Depletion and enhancement modes|Depletion-mode]] n-type [[MOSFET]]s as load transistors allow single voltage operation and achieve greater speed than possible with
The inclusion of depletion-mode NMOS transistors in the [[Semiconductor device fabrication|manufacturing process]] demanded additional manufacturing steps compared to the simpler enhancement-load circuits; this is because depletion-load devices are formed by increasing the amount of [[dopant]] in the load transistors channel region, in order to adjust their [[threshold voltage]]. This is normally performed using [[ion implantation]].
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{{See also|NMOS logic#History}}
In 1965, [[Chih-Tang Sah]], Otto Leistiko and [[Andrew Grove|A.S. Grove]] at [[Fairchild Semiconductor]] fabricated several NMOS devices with channel lengths between [[10 μm process|8{{nbsp}}μm]] and 65{{nbsp}}μm.<ref>{{cite journal |last1=Sah |first1=Chih-Tang |author1-link=Chih-Tang Sah |last2=Leistiko |first2=Otto |last3=Grove |first3=A. S. |title=Electron and hole mobilities in inversion layers on thermally oxidized silicon surfaces |journal=[[IEEE Transactions on Electron Devices]] |date=May 1965 |volume=12 |issue=5 |pages=248–254 |doi=10.1109/T-ED.1965.15489 |bibcode=1965ITED...12..248L |url=https://pdfslide.net/documents/electron-and-hole-mobilities-in-inversion-layers-on-thermally-oxidized-silicon-57e531d33262d.html|url-access=subscription }}</ref> Dale L. Critchlow and [[Robert H. Dennard]] at [[IBM]] also fabricated NMOS devices in the 1960s. The first IBM NMOS product was a [[memory chip]] with 1{{nbsp}}[[kibibit|kb]] data and 50{{ndash}}100 [[nanosecond|ns]] [[access time]], which entered large-scale manufacturing in the early 1970s. This led to MOS [[semiconductor memory]] replacing earlier [[bipolar junction transistor|bipolar]] and [[ferrite-core memory]] technologies in the 1970s.<ref>{{cite journal |last1=Critchlow |first1=D. L. |title=Recollections on MOSFET Scaling |journal=IEEE Solid-State Circuits Society Newsletter |date=2007 |volume=12 |issue=1 |pages=19–22 |doi=10.1109/N-SSC.2007.4785536 |doi-access=free }}</ref>
===Silicon gate===
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===Intel HMOS===
{{redirect|HMOS|operating system|HarmonyOS}}
Intel's own depletion-load NMOS process was known as '''HMOS''', for ''High density, short channel MOS''. The first version was introduced in late 1976 and first used for their [[static RAM]] products,<ref>{{cite journal |first1=A.M. |last1=Volk |first2=P.A. |last2=Stoll |first3=P. |last3=Metrovich |title=Recollections of Early Chip Development at Intel |journal=Intel Technology Journal |volume=5 |issue=Q1 |pages= |date=2001 |url=https://www.intel.com/content/dam/www/public/us/en/documents/research/2001-vol05-iss-1-intel-technology-journal.pdf}}</ref> it was soon being used for faster and/or less power hungry versions of the 8085, 8086, and other chips.
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