Ball grid array: Difference between revisions

Revision as of 20:08, 23 February 2023

Revision as of 07:22, 17 May 2023

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=== Cost of equipment ===

Expensive equipment is required to reliably solder BGA packages; hand-soldering BGA packages is very difficult and unreliable, usable only for the smallest packages in the smallest quantities.<ref>{{cite news |last=Das |first=Santosh |url=http://www.electronicsandyou.com/blog/bga-ball-grid-array-repairing-and-soldering-bga.html |title=BGA Soldering & Repairing / How to Solder Ball Grid Array |work=Electronics and You |date=2019-08-22 |accessdate=2021-09-07 }}</ref> However, as more ICs have become available only in leadless (e.g. [[quad-flat no-leads package]]) or BGA packages, various DIY [[Rework (electronics)#Reflowing and reballing|reflow]] methods have been developed using inexpensive heat sources such as [[heat gun]]s, and domestic [[Toaster#Toaster oven|toaster ovens]] and [[Frying pan#Electric|electric skillets]].<ref>[https://www.sparkfun.com/tutorials/59 Sparkfun tutorials: Reflow skillet, July 2006]</ref>

== Variants ==