Content deleted Content added
No edit summary |
m →Industrial application: lc per MOS:EXPABBR |
||
Line 29:
The second method uses [[test point]]s on the board. These are specific areas placed on the printed board, or [[Printed circuit board|PCB]], that are electrically connected to some of the electronic components on the board. Test points are used to perform functional tests for components mounted on board and, since they are connected directly to some microcontroller pins, they are very effective for ISP. For medium and high production volumes using test points is the best solution since it allows to integrate the programming phase in an assembly line.
In production lines, boards are placed on a bed of nails called [[Test fixture|fixture]]. The latter are integrated, based on the production volumes, in semiautomatic or automatic test systems called [[Automatic test equipment|ATE
== Microchip ICSP ==
|