Ball grid array: Difference between revisions

Revision as of 11:45, 2 November 2023

Revision as of 10:59, 9 November 2023

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The BGA is a solution to the problem of producing a miniature package for an integrated circuit with many hundreds of pins. Pin grid arrays and dual-in-line surface mount ([[Small-outline integrated circuit|SOIC]]) packages were being produced with more and more pins, and with decreasing spacing between the pins, but this was causing difficulties for the soldering process. As package pins got closer together, the danger of accidentally [[Solder bridging|bridging]] adjacent pins with solder grew.

=== Heat conduction ===

== Reliability ==

A further advantage of BGA packages over packages with discrete leads (i.e. packages with legs) is the lower [[thermal resistance]] between the package and the PCB. This allows heat generated by the integrated circuit inside the package to flow more easily to the PCB, preventing the chip from overheating.

BGA sockets haave a higher reliability than LGA or PGA sockets as there are no pins that could lose contact as the solder balls permanantly atatch the IC to the PCB.

=== Low-inductance leads ===