Ball grid array: Difference between revisions

Revision as of 23:38, 25 July 2024

Revision as of 22:31, 6 March 2025

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[[Image:Solder_ball_grid.jpg|thumb|300px|A grid array of solder balls on a printed circuit board after removal of an integrated circuit chip.]]

[[File:Bga und via IMGP4531 wp.jpg|thumb|300x300px|Cross-cut section of BGA mounted circuit]]

A '''ball grid array''' ('''BGA''') is a type of [[surface-mount]] packaging (a [[chip carrier]]) used for [[integrated circuit]]s. BGA packages are used to permanently mount devices such as [[microprocessor]]s. A BGA can provide more interconnection pins thanthat can be put on a [[Dual in-line package|dual in-line]] or [[Quad Flat Package|flat package]]. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.{{cn|date=January 2020}}

Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic [[reflow oven]]s.