Cadence Design Systems: Difference between revisions

Revision as of 20:00, 30 July 2025

Revision as of 05:31, 6 August 2025

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{{See also|Tensilica#Cadence Tensilica products}}

Cadence supplies [[semiconductor intellectual property]] (SIP) blocks, covering [[Interface_(object-oriented_programming)|interface]] design, [[USB]], [[MIPI]], [[ethernet]],<ref>{{cite news |date=2024 |title=Interface IP |url=https://www.cadence.com/en_US/home/tools/ip/design-ip/interface-ip.html |work=Cadence Home Website |access-date=March 13, 2024}}</ref> memory, analog, [[System on a chip|SoC]] peripherals, and [[data plane]] processing units. Cadence also develops chip [[Functional verification|verification]] technologies including simulators and [[formal verification]] tools.{{cn|date=March 2024}} Cadence develops '''[[Tensilica]]''' [[Digital signal processor|DSP]] processors for audio, vision, wireless modems, and convolutional neural nets. Tensilica DSP processors IP in 2019<ref>{{Cite web|url=https://ip.cadence.com/ipportfolio/tensilica-ip|title=Tensilica Customizable Processor and DSP IP|website=ip.cadence.com|access-date=2019-05-16}}</ref> included: Tensilica Vision DSPs for [[Image processor|imaging]], [[Vision processing unit|vision]], and [[AI accelerator|AI]] processing;<ref>AnandTech [https://web.archive.org/web/20190515183857/https://www.anandtech.com/show/14337/cadence-announces-tensilica-vision-q7-dsp Cadence Announces Tensilica Q7 DSP] Retrieved May 15, 2029</ref><ref>Embedded [https://www.embedded.com/cadence-tensilica-vision-q7-dsp-ip-doubles-vision-and-ai-performance-for-automotive-ar-vr-mobile/ Cadence: Tensilica Vision Q7 DSP IP doubles vision and AI performance for automotive, AR/VR mobile] Retrieved May 16, 2019</ref> Tensilica HiFi DSPs for audio processing;<ref>eeNews Embedded [https://www.eenewsembedded.com/news/cadence-tensilica-hifi-5-dsp-audio-and-voice-processing Cadence Tensilica HiFi 5 DSP for audio and voice processing ] Retrieved November 1, 2018</ref><ref>EE Journal [https://www.eejournal.com/article/watching-ai-evolve/ Watching AI Evolve] Retrieved November 12, 2018</ref> Tensilica Fusion DSPs for [[Internet of things|IoT]];<ref>Engineering.com [https://www.engineering.com/ElectronicsDesign/ElectronicsDesignArticles/ArticleID/13267/Electronics-Weekly-Microsemi-PLLs-IDT-Load-Reduced-DIMM-More.aspx Cadence Announces Availability of Tensilica Xtensa LX7 Processor Architecture] Retrieved September 30, 2016</ref> Tensilica ConnX DSPs for [[radar]], [[lidar]], and communications processing;<ref>Embedded Computing Design [https://www.embedded-computing.com/automotive/cadence-tensilica-connx-b20-dsp-ip-boosts-performance-for-automotive-radar-lidar-and-5g Cadence's Tensilica ConnX B20 DSP IP Boosts Performance for Automotive Radar/Lidar and 5G] Retrieved March 8, 2019</ref><ref>Electronics Weekly [https://www.electronicsweekly.com/news/design/eda-and-ip/cadence-ups-dsp-throughput-5g-comms-automotive-radar-lidar-2019-03/ Cadence ups DSP throughput for 5G comms, and automotive radar and lidar] Retrieved March 7, 2019</ref> and Tensilica DNA Processor Family for [[AI accelerator|AI acceleration]].<ref>AnandTech [https://web.archive.org/web/20180919201518/https://www.anandtech.com/show/13377/cadence-announces-tensilica-dna-100-a-bigger-nn-ip Cadence Announces The Tensilica DNA 100 IP: Bigger Artificial Intelligence] Retrieved September 19, 2018</ref><ref>Electronic Design [https://www.electronicdesign.com/technologies/embedded-revolution/article/21807054/cadences-deepneuralnetwork-processor-pushes-to-34-tmacsw Cadence's Deep-Neural-Network Processor Pushes to 3.4 TMACs/W] Retrieved September 26, 2018</ref> In 2021, Cadence launched the Tensilica AI Platform to accelerate AI SoC development and improve performances.<ref>HelpNet Security [https://www.helpnetsecurity.com/2021/09/15/cadence-tensilica-ai-platform/ Cadence Tensilica AI Platform accelerates intelligent SoC development] Retrieved Sep 15, 2021</ref>

===PCB and packaging technologies===