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The original CFP specification was proposed at a time when 10Gbps signals were far more achievable than 25Gbps signals. As such to achieve 100Gbps line rate, the most affordable solution was based on 10 lanes of 10Gbps. However as expected, improvements in technology has allowed higher performance and higher density. Hence the development of the CFP2 and CFP4 specifications. While electrical similar, they specify a form-factor of 1/2 and 1/4 respectively in size of the original specification. Note that CFP, CFP2 and CFP4 modules are not interchangeable (but would be inter-operable at the optical interface with appropriate connectors).
=== CFP ===
<ref name="CFP1.4" /> * 148 pin electrical connection
* integrated digital signal processor within package
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* 10x10G or 4x25G lanes
=== CFP2 ===
* 104 pin electrical connection
* no digital signal processor in package, relies on host card
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* 10x10G or 4x25G or 8x25G lanes
=== CFP4 ===
* 56 pin electrical connection
* no digital signal processor in package, relies on host card
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* 10x10G or 4x25G lanes
=== MSA 5"x7" (Gen 1) ===
<ref>{{Cite web | title=Optical Integration and the Role of DSP in Coherent Optics Modules | url=http://www.ofcconference.org/library/images/ofc/2014/Market%20Watch%20and%20SPS/4-Srivastava-Market-Watch-OFC2013.pdf | accessdate=2015-04-17}}</ref><ref>{{Cite web | title=Multisource Agreement for Generation 2.0 100G Long-Haul DWDM Transmission Module – Electromechanical | url=http://www.oiforum.com/public/documents/OIF-MSA-100GLH-EM-02.0.pdf | accessdate=2015-04-17}}</ref>
* 168 pin electrical connection (designed to be built into a line card)
* digital signal processor within package
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