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Stoichiometric films of selenium-based alloys such as those of Bi-Se and Bi-Te composites are of technical importance for applications in memory switch devices. Thermoanalytical studies often give information about their stoichiometry, melting/boiling points and kinetic reactions responsible for their decomposition and crystallization. A preliminary thermoanalytical study on Bi-Se composites were conducted via thermogravimetry (TG) and differential thermogravimetry (DTG) experiments using a single heating rate and analyzing the measured non-isothermal TG and DTG curves via model-based kinetic reaction formulas of original Coats-Redfern (CR) and Achar-Brindley-Sharp (ABS) equations, as described in the following paper, though it is always preferable to analyze such TG and DTG data on the basis of model-free kinetic reaction formulations and several heating rates.<ref>{{Cite journal|last=Ahmad|first=Mais Jamil A.|last2=Jafar|first2=Mousa M. Abdul-Gader|last3=Saleh|first3=Mahmoud H.|last4=Shehadeh|first4=Khawla M.|last5=Telfah|first5=Ahmad|last6=Ziq|first6=Khalil A.|date=2017-09-30|title=Evaluation of Kinetic Parameters and Thermal Stability of Melt-Quenched Bi<sub>x</sub>Se<sub>100−x</sub> Alloys (x ≤7.5 at%) by Non-Isothermal Thermogravimetric Analysis|url=http://www.appmicro.org/journal/view.html?uid=223&&vmd=Full|journal=Applied Microscopy|language=en|volume=47|issue=3|doi=10.9729/AM.2017.47.3.110|issn=2287-5123}}</ref>
In my laboratory, a number of studies were carried out on undoped amorphous and crystalline selenium films, in which their structure and electric/dielectric properties have been investigated and analyzed. Several articles and MSc theses by my students were written on such topics, a few of them are listed in the references below.<ref>{{Cite journal|last=Abdul-Gader Jafar|first=M. M.|last2=Nigmatullin|first2=R. R.|date=2001-09-21|title=Identification of a new function model for the AC-impedance of thermally evaporated undoped selenium films using the Eigen-coordinates method|url=http://www.sciencedirect.com/science/article/pii/S004060900101166X|journal=Thin Solid Films|volume=396|issue=1|pages=282–296|doi=10.1016/S0040-6090(01)01166-X}}</ref>
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