Ball grid array: Difference between revisions

Revision as of 19:42, 27 November 2004

Revision as of 07:28, 22 December 2004

Line 11:

Another disadvantage of BGAs is that, once the package is soldered down, it is very difficult to look for soldering faults. [[X-ray]] machines and special microscopes have been developed to overcome this problem, but are expensive. If a BGA is found to be badly soldered, it can be removed in a ''rework station'', which is a jig fitted with infrared lamp, a [[thermocouple]] and a vacuum device for lifting the package. The BGA can be replaced with a new one, or can be refurbished or ''reballed''. Packets of tiny ready-made solder balls are sold for this purpose.

[[Category:ElectronicsChip carriers]]

[[de:Ball Grid Array]]