Reliability prediction for electronic components: Difference between revisions

Revision as of 15:31, 15 March 2020

Revision as of 17:20, 13 March 2025

Line 32:

:# ''Unit'': Any assembly of devices. This may include, but is not limited to, circuit packs, modules, plug-in units, racks, power supplies, and ancillary equipment. Unless otherwise dictated by maintenance considerations, a unit will usually be the lowest level of replaceable assemblies/devices. The RPP is aimed primarily at reliability prediction of units.

:# ''Serial System'': Any assembly of units for which the failure of any single unit will cause a failure of the system.

== Data-driven reliability predictions ==

Data-driven models for reliability prediction utilise data aquired from tests to failure on electronic components by establishing relationships between the different variables presented in the data. As such relationships can be complex, data-driven models often require computations in high dimensions, which means that a large dataset is needed to optimize the output of the model.<ref>{{cite conference |last1=Ghrabli |first1=Mehdi|last2=Bouarroudj |first2=Mounira | author3=Chamoin, Ludovic|author4=Aldea, Emanuel |date=2024 |title=Hybrid modeling for remaining useful life prediction in power module prognosis |url=https://ieeexplore.ieee.org/document/10491493 |conference=2024 25th International Conference on Thermal Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)|___location=Catania, Italy |publisher=IEEE|doi=10.1109/EuroSimE60745.2024.10491493 }}</ref>

== Physics-based reliability predictions ==

Physics based reliability predictions use physical equations and formulae to determine failure. This approach requires precise knowledge of the degradation process and the physical properties to ensure accuracy. These models often utilise numerical simulations to infer the quantities needed by the model.<ref>{{ cite journal | title=Physics-informed Markov chains for remaining useful life prediction of wire bonds in power electronic modules | journal=Microelectronics Reliability | year=2025 | last1=Ghrabli | author2=Bouarroudj, Mounira | author3=Chamoin, Ludovic|author4=Aldea, Emanuel | volume=167 | pages=1–12 | first1=Mehdi | doi=10.1016/j.microrel.2025.115644| url=https://www.sciencedirect.com/science/article/pii/S0026271425000575 }}</ref>

== References ==