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A cheaper and easier inspection method, albeit destructive, is becoming increasingly popular because it does not require special equipment. Commonly referred to as [[Dye-and-Pry|dye and pry]], the process includes immersing the entire PCB or just the BGA attached module into a [[dye]], and after drying, the module is pried off and the broken joins are inspected. If a solder ___location contains the dye, then it indicates that the connection was imperfect.<ref>{{cite web
| url = http://www.cascade-eng.com/
| title = Dye and Pry of BGA Solder Joints
| date = 2013-11-22
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