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* ''WFBGA'': very very thin profile fine pitch ball grid array
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Effectively also the [[flip chip]] methods for mounting chip dies to a carrier is sort of a BGA design derivate with the functional equivalent of the balls there being called bumps or micro bumps. This is realized at an already microscopic size level.
To make it easier to use ball grid array devices, most BGA packages only have balls in the outer rings of the package,
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