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==Approach==
Users upload either a complete design package, like [[ODB++]] or IPC-2581,<ref>{{cite web |url=http://www.ipc2581.com/ |title=Home |website=ipc2581.com}}</ref> or individual data packets, such as [[Gerber format|Gerber]], [[Bill of Materials]], and Pick and Place<ref>{{Cite web|url=http://www.orcad.com/resources/library/pick-and-place-report|title=Pick and Place Report}}</ref> files.
Sherlock incorporates stresses from a variety of environments into its physics-based prediction algorithms, including elevated temperature, thermal cycling, vibrations (random and harmonic), mechanical shock and electrical stresses (voltage, current, power). Sherlock then performs several different types of reliability analysis and provides the useful (constant failure rate) and wear out (increasing failure rate) portions of the life curve for each mechanism-component combination. The specific mechanisms that are evaluated and predicted include low-cycle [[solder fatigue]] due to thermal cycling, high-cycle [[solder fatigue]] due to [[vibration]], solder cracking/component cracking/[[pad cratering]] due to [[shock (mechanics)|mechanical shock]] or excessive flexure, lead fatigue, [[wire bonding|wire bond fatigue]], [[Via (electronics)|via]] fatigue, [[electromigration]], time dependent dielectric breakdown, [[hot-carrier injection]], and negative bias temperature instability. Published research has indicated that the [[physics of failure]]-based predictions are highly accurate<ref>Hillman, Craig, Nathan Blattau, and Matt Lacy. "Predicting Fatigue of Solder Joints Subjected to High Number of Power Cycles." IPC APEX (2014).</ref> and are now used to validate other techniques.<ref>Bhavsar, Nilesh R., H. P. Shinde, and Mahesh Bhat. "Determination of Mechanical Properties of PCB." Ijmer journal 2.4.</ref>
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