Ball grid array: Difference between revisions

Revision as of 21:52, 13 November 2022

Revision as of 03:04, 21 February 2023

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=== Difficulties during circuit development ===

During development it is not practical to solder BGAs into place, and sockets are used instead0instead, but tend to be unreliable. There are two common types of socket: the more reliable type has spring pins that push up under the balls, although it does not allow using BGAs with the balls removed as the spring pins may be too short.

The less reliable type is a [[ZIF socket]], with spring pinchers that grab the balls. This does not work well, especially if the balls are small.{{Citation needed|date=March 2013}}