Ball grid array: Difference between revisions

Revision as of 03:04, 21 February 2023

Revision as of 20:08, 23 February 2023

Line 60:

=== Difficulties during circuit development ===

During development it is not practical to solder BGAs into place, and sockets are used 0insteadinstead, but tend to be unreliable. There are two common types of socket: the more reliable type has spring pins that push up under the balls, although it does not allow using BGAs with the balls removed as the spring pins may be too short.

The less reliable type is a [[ZIF socket]], with spring pinchers that grab the balls. This does not work well, especially if the balls are small.{{Citation needed|date=March 2013}}