Ball grid array: Difference between revisions

Revision as of 07:22, 17 May 2023

Revision as of 17:34, 23 September 2023

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For example, the "micro-FCBGA" (flip chip ball grid array) is Intel's current{{When|date=May 2011}} BGA mounting method for mobile processors that use a [[flip chip]] binding technology. It was introduced with the ''Coppermine'' Mobile Celeron.{{Citation needed|date=April 2016}} Micro-FCBGA has 479 balls that are 0.78 mm in diameter. The processor is affixed to the motherboard by soldering the balls to the motherboard. This is thinner than a pin grid array socket arrangement, but is not removable.

The 479 balls of the Micro-FCBGA package (a package almost identical to the 478-pin socketable [[micro-FCPGA]] package) are arranged as the 6 outer rings of a 1.27&nbsp;mm pitch (20 balls per inch pitch) 26x26 square grid, with the inner 14x14 region empty.<ref>Intel.

Intel.

"Mobile Intel Celeron Processor (0.13 μ) in Micro-FCBGA and Micro-FCPGA Packages".

[http://pdf.seekdatasheet.com/2008715/200807151345533917.pdf Datasheet] {{Webarchive|url=https://web.archive.org/web/20140318091556/http://pdf.seekdatasheet.com/2008715/200807151345533917.pdf |date=2014-03-18 }}.

2002.</ref><ref>{{Cite web |url=http://www.x86-guide.com/en/articles/packages/FCBGA-479%20(Micro-FCBGA)-no56.html |title=FCBGA-479 (Micro-FCBGA) |access-date=2011-12-20 |archive-date=2021-02-28 |archive-url=https://web.archive.org/web/20210228145820/http://www.x86-guide.com/en/articles/packages/FCBGA-479%20(Micro-FCBGA)-no56.html |url-status=dead }}</ref>

2002.

</ref><ref>[http://www.x86-guide.com/en/articles/packages/FCBGA-479%20(Micro-FCBGA)-no56.html FCBGA-479 (Micro-FCBGA)]</ref>

== Procurement ==

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* [https://amkor.com/packaging/laminate/pbga/ PBGA Package Information] from [[Amkor Technology]]

* [https://c44f5d406df450f4a66b-1b94a87d576253d9446df0a9ca62e142.ssl.cf2.rackcdn.com/2015/03/PBGA-J-Devices-DSJD401.pdf PBGA Package Information] {{Webarchive|url=https://web.archive.org/web/20190102095019/https://c44f5d406df450f4a66b-1b94a87d576253d9446df0a9ca62e142.ssl.cf2.rackcdn.com/2015/03/PBGA-J-Devices-DSJD401.pdf |date=2019-01-02 }} from J-Devices Corporation

{{Semiconductor packages}}