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In DRIE of glass the problem is the high plasma power needed, which makes it difficult to find suitable mask materials for truly deep etching. Polysilicon and nickel are used successfully for 10-50µm etched depths. In DRIE of polymers, Bosch process with alternating steps of oxygen etching and C<sub>4</sub>F<sub>8</sub> passivation take place. Metal masks can be used.
== Main Player ==
Alcatel Vacuum Technology has been involved in plasma processing for more than 25 years.
Its first equipment based on a Alcatel patented Inductive Coupled Plasma (ICP) source, with independent source power and substrate bias control for deep etching of silicon was launched in 1993. The exponential growth potential of the MEMS (Micro Electro Mechanical Systems) industry gave birth to the Micro Machining Systems business group (MMS) in 1994.
'''Adixen Micro Machining Systems''' (AMMS) is now a business unit within Alcatel Vacuum Technology headquartered in Annecy, France. Adixen MMS is a world-class supplier of deep plasma etching systems to manufacturers of MEMS (Micro Electro Mechanical Systems) and devices related to microelectronics and micropackaging applications. With their very high aspect ratio trench etch, superior etch rate and profile control capabilities, the Alcatel Micro Machining Systems AMS "I-Productivity" DRIE ICP systems offer the key technology to meet the most challenging deep plasma etching requirements.
The AMS "I-Productivity" tool range includes process and hardware platforms developed for superior deep plasma etching of Silicon, SOI and Glass-like materials. The tools can be configured to meet the specific requirements of various manufacturing configurations, from R&D to high volume production environments.
[[Category:Semiconductor device fabrication]]
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