Content deleted Content added
Line 292:
===Multipatterning productivity improvements===
Since 2017, several publications have indicated ways to improve multipatterning productivity. Self-aligned blocking allows blocking or cutting patterns to cross adjacent lines.<ref>F. Lazzarino et al., Proc. SPIE 10149, 1014908 (2017)</ref> Cut redistribution allows distances between cuts to be adjusted to minimize the number of cut masks.<ref>Z. Xiao et al., Proc. SPIE 8880, 888017 (2013).</ref><ref>[https://www.linkedin.com/pulse/self-aligned-block-redistribution-expansion-improving-frederick-chen-rgnwc/ Self-Aligned Block Redistribution and Expansion for Improving Multipatterning Productivity]</ref> These techniques may also be combined with self-aligned vias, described earlier.<ref>J-H. Franke et al., Proc. SPIE 10145, 1014529 (2017).</ref>
The use of a via grid defined by intersecting diagonal lines can simplify patterning of both metal and via layers.<ref>[https://www.youtube.com/watch?v=KANhWaM9u_U 2nm Routing and Patterning Simplification with Diagonal Via Grid]</ref>
==Industrial adoption==
| |||