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=== Integration ===
In 2012 the coarse-grained architectural approach was taken a step further by combining the [[logic block]]s and interconnects of traditional FPGAs with embedded [[microprocessor]]s and related peripherals to form a complete [[System on a chip|system on a programmable chip]]. Examples of such hybrid technologies can be found in the [[Xilinx]] Zynq-7000 all [[
=== Clocking ===
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* [[Achronix]], manufacturing SRAM based FPGAs with 1.5 GHz fabric speed<ref>{{Cite press release |url=http://newsroom.intel.com/community/intel_newsroom/blog/2010/11/01/chip-shot-achronix-to-use-intel-s-22nm-manufacturing |title=Achronix to Use Intel's 22nm Manufacturing |date=2010-11-01 |work=Intel Newsroom |access-date=2018-12-01 |language=en-US |archive-date=2015-09-30 |archive-url=https://web.archive.org/web/20150930082224/http://newsroom.intel.com/community/intel_newsroom/blog/2010/11/01/chip-shot-achronix-to-use-intel-s-22nm-manufacturing |url-status=dead }}{{better source needed|{{subst:DATE}}|date=September 2024}}</ref>
*[[Altium]], provides system-on-FPGA hardware-software design environment.<ref>{{cite book |last1=Maxfield |first1=Clive |title=The Design Warrior's Guide to FPGAs |date=16 June 2004 |publisher=Elsevier Science |isbn=9780080477138 |url=https://books.google.com/books?id=dnuwr2xOFpUC&dq=fpga+altium&pg=PA117}}</ref>
* Cologne Chip, German
* [[Efinix]] offers small to medium-sized FPGAs. They combine logic and routing interconnects into a configurable XLR cell.{{cn|date=September 2024}}
* [[GOWIN Semiconductors]], manufacturing small and medium-sized SRAM and
* [[Lattice Semiconductor]] manufactures [[Low-power electronics|low-power]] SRAM-based FPGAs featuring integrated configuration flash, [[instant-on]] and live [[Reconfigurable computing|reconfiguration]]
** [[SiliconBlue Technologies]] provides extremely low-power SRAM-based FPGAs with optional integrated [[Non-volatile memory|nonvolatile]] configuration memory; acquired by Lattice in 2011
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In 2012 researchers Sergei Skorobogatov and Christopher Woods demonstrated that some FPGAs can be vulnerable to hostile intent. They discovered a critical [[Backdoor (computing)|backdoor]] [[Vulnerability (computing)|vulnerability]] had been manufactured in silicon as part of the Actel/Microsemi ProAsic 3 making it vulnerable on many levels such as reprogramming crypto and [[access key]]s, accessing unencrypted bitstream, modifying [[low-level]] silicon features, and extracting [[Computer configuration|configuration]] data.<ref>{{cite book |volume=7428|pages=23–40|doi=10.1007/978-3-642-33027-8_2|series = Lecture Notes in Computer Science|year = 2012|last1 = Skorobogatov|first1 = Sergei|title=Cryptographic Hardware and Embedded Systems – CHES 2012|last2=Woods|first2=Christopher|isbn=978-3-642-33026-1|chapter=Breakthrough Silicon Scanning Discovers Backdoor in Military Chip}}</ref>
In 2020 a critical vulnerability (named "Starbleed") was discovered in all Xilinx
== Similar technologies ==
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