Reliability prediction for electronic components: Difference between revisions

Revision as of 17:16, 1 February 2011

Revision as of 18:23, 15 February 2011

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:* '''Can be used to set achievable in-service performance standards''' against which to judge actual performance and stimulate action.

The telecommunications industry has devoted much time over the years to concentrate on developing reliability models for electronic equipment. One such tool is the Automated Reliability Prediction Procedure (ARPP), which is an Excel-spreadsheet software tool that automates the reliability prediction procedures in [http://telecom-info.telcordia.com/site-cgi/ido/docs.cgi?ID=SEARCH&DOCUMENT=SR-332& SR-332, Reliability Prediction Procedure for Electronic Equipment.] FD-ARPP-01 provides suppliers and manufacturers with a tool for making Reliability Prediction Procedure (RPP) calculations. It also provides a means for understanding RPP calculations through the capability of interactive examples provided by the user.

The RPP views electronic systems as hierarchical assemblies. Systems are constructed from units that, in turn, are constructed from devices. The methods presented predict reliability at these three hierarchical levels:

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:# ''Unit'': Any assembly of devices. This may include, but is not limited to, circuit packs, modules, plug-in units, racks, power supplies, and ancillary equipment. Unless otherwise dictated by maintenance considerations, a unit will usually be the lowest level of replaceable assemblies/devices. The RPP is aimed primarily at reliability prediction of units.

:# ''Serial System'': Any assembly of units for which the failure of any single unit will cause a failure of the system.

== References ==