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# Laser ablation of parts of the conductive material
# Mounting SMD LEDs on the glass by means of a pick-and-place process
# Lamination of the glasses according the specification mentioned above{{fact|date=October 2011}}
Because most of the glass companies are not skilled to mount LEDs (light emitting diodes) onto metallized glass, it makes sense to locate the LEDs on a separate transparent conductive polymeric interlayer<ref>D. Shavit: The developments of LEDs and SMD Electronics on transparent conductive Polyester film, Vacuum International, 1/2007, S. 35 ff</ref>,<ref>D. Shavit: Elektronische Komponenten in Glaslaminaten: Entwicklung, Stand und Ausblick, Glas, Architektur & Technik, 1/2007</ref>,<ref>SUN-TEC Swiss United Technologies Inc. Daniel Shavit, DE202007008410 [http://v3.espacenet.com/publicationDetails/biblio?DB=EPODOC&adjacent=true&locale=en_EP&FT=D&date=20090630&CC=CH&NR=698260B1&KC=B1 "Translucent conductive Interlayer with SMD Surface Mounted Electronic Devices – LED embedded films"]</ref> which may be laminated by any glass lamination unit. In other words, the remaining process for glass lamination units will consist of laminating together standard glass using 2 layers of thermoplastic interlayers to sandwich ready to use LED-embedded films. This process will be quite similar for 3D curved LED–glass<ref>[http://www.ledglass.ch Video with 3D curved laminated LED–glass]</ref>. The final specification will be:
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