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* in MEMS, DRIE is used for anything from a few micrometers to 0.5 mm.
* in irregular chip dicing, DRIE is used with a novel hybrid soft/hard mask to achieve sub-millimeter etching to dice silicon dies into lego-like pieces with irregular shapes.<ref>{{cite journal | last1= Ghoneim | first1= Mohamed | last2 = Hussain | first2= Muhammad | title = Highly Manufacturable Deep (Sub-Millimeter) Etching Enabled High Aspect Ratio Complex Geometry Lego-Like Silicon Electronics| journal= small | date= 1 February 2017 | url = http://onlinelibrary.wiley.com/wol1/doi/10.1002/smll.201601801/full}}</ref> <ref>{{cite news | last= Mendis | first= Lakshini | title= Lego-like Electronics | newspaper= Nature Middle East | date= 14 February 2017 | url=http://www.natureasia.com/en/nmiddleeast/article/10.1038/nmiddleeast.2017.34}}</ref> <ref>{{cite news | last= Berger | fist= Michael | title=Lego like silicon electronics fabricated with hybrid etching masks | newspaper= Nanowerk | date= 6 February 2017 | url= http://www.nanowerk.com/spotlight/spotid=45763.php}}</ref>
* in flexible electronics, DRIE is used to make tradition monolithic CMOS devices flexible by reducing the thickness of silicon substrates to few to tens of micrometers. <ref>{{ cite journal | last1= Ghoneim | first1= Mohamed | first2=Nasir | last2=Alfaraj | first3=Galo | last3=Torres-Sevilla | first4=Hossain | last4=Fahad | first5=Muhammad | last5=Hussain | title=Out-of-Plane Strain Effects on Physically Flexible FinFET CMOS | journal=Transactions on Electron Devices | date= July 2016 | url=http://ieeexplore.ieee.org/abstract/document/7471458/}}</ref> <ref>{{ cite journal | first1= Mohamed T. | last1= Ghoneim | first2= Muhammad M. | last2= Hussain | title=Review on physically flexible nonvolatile memory for internet of everything electronics | journal= electronics | date=23 July 2015 | url= http://www.mdpi.com/2079-9292/4/3/424/htm}}</ref>
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