Deep reactive-ion etching: Difference between revisions

Revision as of 13:57, 18 February 2017

Revision as of 11:34, 26 February 2017

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===Precision Machinery===

DRIE has enabled the use of silicon mechanical components in high-end wristwatches. According to an engineer at [[Cartier (jeweler)|Cartier]], “There is no limit to geometric shapes with DRIE,”.<ref>{{cite news | last = Kolesnikov-Jessop | first = Sonia | title = Precise Future of Silicon Parts Still Being Debated | newspaper = The New York Times | ___location = New York | date = 23 November 2012 | url = httphttps://www.nytimes.com/2012/11/24/fashion/24iht-acaw2-silicon24.html }}</ref> With DRIE it is possible to obtain an [[aspect ratio]] of 30 or more,<ref>{{cite journal | last1 = Yeom | first1 = Junghoon | last2 = Wu | first2 = Yan | last3 = Selby | first3 = John C. | last4 = Shannon | first4 = Mark A. | title = Maximum achievable aspect ratio in deep reactive ion etching of silicon due to aspect ratio dependent transport and the microloading effect | journal = J. Vac. Sci. Technol. B | date = 31 October 2005 }}</ref> meaning that a surface can be etched with a vertical-walled trench 30 times deeper than its width.

This has allowed for silicon components to be substituted for some parts which are usually made of steel, such as the [[hairspring]]. Silicon is lighter and harder than steel, which carries benefits but makes the manufacturing process more challenging.