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* Electrical stresses (voltage, current, power)
[[File:Sherlock map showing strain expected during impact across the PCBA.png|thumb|left|alt=Sherlock map showing strain expected during impact across the PCBA]]
Sherlock then performs several different types of reliability analysis and provides the useful (constant failure rate) and wear out (increasing failure rate) portions of the life curve for each mechanism-component combination. The specific mechanisms that are evaluated and predicted include low-cycle [[solder fatigue]] due to thermal cycling, high-cycle [[solder fatigue]] due to [[vibration]], solder cracking/component cracking/[[pad cratering]] due to [[shock (mechanics)|mechanical shock]] or excessive flexure, lead fatigue, [[wire bonding|wire bond fatigue]], [[Via (electronics)|via]] fatigue, [[electromigration]], time dependent dielectric breakdown, [[hot-carrier injection]], and negative bias temperature instability. Published research has indicated that the [[physics of failure]]-based predictions are relative accurate<ref>Hillman, Craig, Nathan Blattau, and Matt Lacy. "Predicting Fatigue of Solder Joints Subjected to High Number of Power Cycles." IPC APEX (2014).</ref> and are now used to validate other techniques.<ref>Bhavsar, Nilesh R., H. P. Shinde, and Mahesh Bhat. "Determination of Mechanical Properties of PCB." Ijmer journal 2.4.</ref>
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