Ball grid array: Difference between revisions

Revision as of 21:36, 4 July 2019

Revision as of 19:55, 1 September 2019

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{{Refimprove|date=September 2010}}

[[Image:Solder_ball_grid.jpg|thumb|300px|A grid array of solder balls underon ana integratedprinted circuit chip,board withafter theremoval chipof removed;an the balls were left attached to the printedintegrated circuit boardchip.]]

A '''ball grid array''' ('''BGA''') is a type of [[surface-mount]] packaging (a [[chip carrier]]) used for [[integrated circuit]]s. BGA packages are used to permanently mount devices such as [[microprocessor]]s. A BGA can provide more interconnection pins than can be put on a [[Dual in-line package|dual in-line]] or [[Quad Flat Package|flat package]]. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.