Revision as of 16:55, 19 September 2019 edit Serols (talk \| contribs) Extended confirmed users, Pending changes reviewers 482,750 edits m Reverted edits by 67.21.155.89 (talk) (HG) (3.4.8) Tags: Huggle Rollback ← Previous edit		Revision as of 07:35, 13 October 2019 edit undo 115.189.101.41 (talk) →Noncompliant connections Next edit →
Line 27: [[Image:BGA joint xray.jpg\|thumb\|120px\|[[X-ray]] of BGA]] === ~~Noncompliant~~Lack ~~connections~~of compliance=== A disadvantage of BGAs is that the solder balls cannot flex in the way that longer leads can, so they are not mechanically [[stiffness#Compliance\|compliant]]. As with all surface mount devices, bending due to a difference in [[Thermal expansion\|coefficient of thermal expansion]] between PCB substrate and BGA (thermal stress) or flexing and vibration (mechanical stress) can cause the solder joints to fracture.

Ball grid array: Difference between revisions