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=== Heat conduction ===
A further advantage of BGA packages over packages with discrete leads (i.e. packages with legs) is the lower [[thermal resistance]] between the package and the PCB. This allows heat generated by the integrated circuit inside the package to flow more easily to the PCB, preventing the chip from overheating. Who write this aberration ? a... DIY-er ??? WHERE ARE... WIKIPEDIA ? OLD... WIKIPEDIA ? next... will be... DIY-ers on the moon !
=== Low-inductance leads ===
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