Revision as of 22:20, 17 December 2019 edit 95.125.28.110 (talk) →Heat conduction: ask for real documented people Tags: Mobile edit Mobile web edit ← Previous edit		Revision as of 22:20, 17 December 2019 edit undo ClueBot NG (talk \| contribs) Bots, Pending changes reviewers, Rollbackers 6,476,261 edits m Reverting possible vandalism by 95.125.28.110 to version by 115.189.101.41. Report False Positive? Thanks, ClueBot NG. (3683905) (Bot) Tag: Rollback Next edit →
Line 19: === Heat conduction === A further advantage of BGA packages over packages with discrete leads (i.e. packages with legs) is the lower [[thermal resistance]] between the package and the PCB. This allows heat generated by the integrated circuit inside the package to flow more easily to the PCB, preventing the chip from overheating. ~~Who write this aberration ? a... DIY-er ??? WHERE ARE... WIKIPEDIA ? OLD... WIKIPEDIA ? next... will be... DIY-ers on the moon !~~ === Low-inductance leads ===

Ball grid array: Difference between revisions