High Bandwidth Memory: differenze tra le versioni

Versione delle 01:08, 28 mar 2018

Versione delle 01:10, 28 mar 2018

Riga 6:

Le High Bandwidth Memory sono state adottate dallo [[JEDEC]] come standard industriale nell'ottobre [[2013]].<ref name="HBM_JEDEC">[http://www.jedec.org/standards-documents/results/jesd235 HIGH BANDWIDTH MEMORY (HBM) DRAM (JESD235)], JEDEC, October 2013</ref> La seconda generazione, le HBM2, sono state accetate dallo JEDEC nel gennaio 2016.<ref name="HBM2_JEDEC">{{cite web |url=https://www.jedec.org/news/pressreleases/jedec-updates-groundbreaking-high-bandwidth-memory-hbm-standard |title=JESD235a: High Bandwidth Memory 2 |date=2016-01-12}}</ref>

== Evoluzione ==

*HBM

*HBM2

*HBM3: Nel 2016 viene annunciato lo sviluppo di una terza versione di memorie HBM<ref>{{cita news|last1=Walton|first1=Mark|title=HBM3: Cheaper, up to 64GB on-package, and terabytes-per-second bandwidth|url=https://arstechnica.com/gadgets/2016/08/hbm3-details-price-bandwidth/|accessdate=3 February 2017|publisher=Ars Technica|date=23 August 2016}}</ref><ref>{{cita news|last1=Ferriera|first1=Bruno|title=HBM3 and GDDR6 emerge fresh from the oven of Hot Chips|url=https://techreport.com/news/30559/hbm3-and-gddr6-emerge-fresh-from-the-oven-of-hot-chips|accessdate=3 February 2017|publisher=Tech Report|date=23 August 2016}}</ref>

*HBM4

== Note ==