Ball grid array: Difference between revisions

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== Variants ==
[[Image:Celeron mobile.jpg|thumb|300px|Intel [[Mobile Celeron]] in a [[flip-chip]] BGA2 package (FCBGA-479); the [[Die (integrated circuit)|die]] appears dark blue. Here the die has been mounted to a printed circuit board substrate below it (dark yellow, also called an interposer) using flip chip.]]
[[File:NVIDIA@220nm@Fixed-pipline@NV10@GeForce 256@T5A3202220008 S1 Taiwan A DSC01376 (29588383793).jpg|thumb|Inside a [[Wire bonding|wire bond]] BGA package; this package has an Nvidia [[GeForce 256]] GPU]]
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